Technical Lead

Job Description (Posting).

IC Package Design Engineer Experience with IC Package Design using Allegro Package Designer (APD), IC Package Design experience. Good understanding of packagesubstrate design and package assembly rules related to flip chip designs. Exposure to different package technologies such as MCM, flip chip wire bond, 3D, 2.5D etc., added advantage Expertise in High Speed Complex Package designs with HDI, Blind and Buried Via technologies. Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, GDDR, LPDDR and HSIO interfaces including PCIe, SERDES Good Exposure to Stackup design, DFM, DFA rules and adherence. Should have expertise in constraint setting in layout tool.IC Package design / Substrate design experience is mandatoryShould be able to work with customer SPOC independentlyShould have experience in all phases of PCB/Package design phases (from net-in to Gerber generation) (1.) To collaborate with key stakeholders, to understand business objectives and work with them to integrate design thinking into softwareorproduct development. (2.) To lead a team of designers, provide guidance, and ensuring the delivery of high-quality design solutions in alignment with the overall business goals. (3.) To present design concepts and strategies to stakeholders and gather feedback. (4.) To establish and maintain design standards, guidelines, and best practices. (5.) To stay abreast of industry trends, emerging technologies to drive innovation and excellence in design.

Skill (Primary)

Technical Skills (ERS)-HW PCB Advanced-High Speed PCB design practices