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Electronic Components/Semiconductors
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
JR55609 Sr Mgr - ASIC/PMIC TPMSenior Manager - ASIC/PMIC Package Technical ProgramManager
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
In this role you will be responsible forASIC/PMIC package design, assembly build execution, and successful qualification release into production. You will develop packaging roadmaps and technical specifications, and collaborate with cross-functional internal engineering teams, commercial, supply chain, external OSATs, and external suppliers. As TPM you will also representPackage Development Engineering in Product Development Team (PDT) meetings and Business Unit meetings.
Responsibilities
Package technical requirements & specifications for package design, package assembly, and PCB assembly integration for Module/SSD products.Review, align, and enforce with internal teams and suppliers of procured components.
Responsible for packagerisk assessments, package design schedule, assembly schedule, package cost, and successfully passing package and PCBA qualifications
Represent Package Development Engineering(PDE) at Product Development Team meetings, providing package updates and decisions as necessary
Attend PLM milestone and stage gate review meetings to represent PDE for review and approval of projects as needed
Maintain internal and external ASIC/PMIC packaging roadmaps
Managing package roadmap reviews, summarizing competitive analysis reviews, and summarizing OSAT packaging capabilities & rules
Support architecture pathfinding activities with package design solution proposals, risk assessments, and coordinate budgetary package costing of pathfinding projects
Resolve quality issues related to packaging responsibilities for life of products
Requirements
The applicant should have a BS degree or higher in EE, ME, MatE, ChemE, etc.
15+ years of relevant experience
Good communication and presentation skills
Able to work in a global environment across multiple time zones and countries
PCB assembly and packaging assembly experience is preferred
Package Design or Hardware Design engineering experience is desirable
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations,please contact
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Date Posted: 08/10/2024
Job ID: 95523995
Micron is a world leader in innovative memory solutions that transform how the world uses information. We have approximately 40,000 team members in 17 countries who work with the world’s most trusted brands, delivering memory and storage systems for a broad range of applications and sparking countless possibilities in technology..
