Sr Mgr - ASIC/PMIC TPM

Senior Manager - ASIC/PMIC Package Technical ProgramManager

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

In this role you will be responsible forASIC/PMIC package design, assembly build execution, and successful qualification release into production. You will develop packaging roadmaps and technical specifications, and collaborate with cross-functional internal engineering teams, commercial, supply chain, external OSATs, and external suppliers. As TPM you will also representPackage Development Engineering in Product Development Team (PDT) meetings and Business Unit meetings.

Responsibilities

• Package technical requirements & specifications for package design, package assembly, and PCB assembly integration for Module/SSD products.Review, align, and enforce with internal teams and suppliers of procured components.

• Responsible for packagerisk assessments, package design schedule, assembly schedule, package cost, and successfully passing package and PCBA qualifications

• Represent Package Development Engineering(PDE) at Product Development Team meetings, providing package updates and decisions as necessary

• Attend PLM milestone and stage gate review meetings to represent PDE for review and approval of projects as needed

• Maintain internal and external ASIC/PMIC packaging roadmaps

• Managing package roadmap reviews, summarizing competitive analysis reviews, and summarizing OSAT packaging capabilities & rules

• Support architecture pathfinding activities with package design solution proposals, risk assessments, and coordinate budgetary package costing of pathfinding projects

• Resolve quality issues related to packaging responsibilities for life of products

Requirements

• The applicant should have a BS degree or higher in EE, ME, MatE, ChemE, etc.

• 15+ years of relevant experience

• Good communication and presentation skills

• Able to work in a global environment across multiple time zones and countries

• PCB assembly and packaging assembly experience is preferred

• Package Design or Hardware Design engineering experience is desirable