Drive leadframe/packing material development activities to ensure the package fulfills all requirements in the aspect of manufacturing, product qualification and reliability.
In your new role you will:
- Be the technical expert for package development projects leadframe/packing material.
- Perform design,drawing and specification for leadframe based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.
- Collaborate with internal and material supplier on packing material design, specification and selection; and ensure design for manufacturing, quality and cost.
- Drive leadframe/packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc).
- Liaise with SQM and supplier to ensure fulfilment of quality requirement/FAI for leadframe/packing material; and qualification release.
- Establish design guidelines/requirements for leadframe/packing material specification.
- Generate technical papers/journals and patents related to lead frame/package design that enhance technical value.
- Support incoming material quality, work with suppliers/internal to resolve technology/quality issues, improvement programs, etc.
- Involve in leadframe/packing material technology road mapping, UPEG activity, material selection to meet roadmap requirement.
- Actively engages with leadframe/packing material suppliers to explore new technology, and best-in-cost design to achieve competitive advantages.
You are best equipped for this task if you have:
- Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
- At least 7 years of working experience in semiconductor assembly and packaging development; and relevance experience in leadframe/packing material is preferred.
- Leadframe design/packing material development & qualification.
- Drafting/designing (2D/3D) leadframe using AutoCAD/Inventor.
- Knowledge in material physics/properties for leadframe and packing material.
- GD&T knowledge/material specification definition.
- Basic semiconductor packaging, assembly and test.
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in
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