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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
JR60702 Senior Engineer PDE PDS/DT
As a Process Simulation Engineer at Micron Technology, Inc. you will work in Package Development Engineering on Process & Equipment simulations for advanced semiconductor packaging need. The scope is to address all process & equipment aspects of packaging technology and associated design, material, process & equipment interactions. This position will collaborate with package design, electrical and physical characterization, assembly R&D and other process module teams.
Job Description
Responsibilities
- Partner with process engineering teams to understand the packaging process and develop analysis models.
- Guide test vehicle development to improve simulation correlation to empirical data. Develop test plan wherever necessary to verify the simulation models and validate analysis approach in correlation with test outcomes.
- Participates in development of simulation modeling methodologies in flow, thermal and Multiphysics domain
- Simulate flow and thermal analysis of the various process involved in semiconductor packaging like for predicting and enhancing the performance
- Provide process & equipment simulation reports to support pathfinding efforts, technology development, and product introduction
- Deploys developed simulation methodologies to strengthen Analysis First strategy and develop Digital Twins.
- Communicate CFD analysis results to process engineers and provide technical and/or design recommendations.
- Responsible for mentoring and maturing analysis capability of Flow and Thermal technology domain
Requirements
- Solid knowledge through coursework, or experience required, in multi-physics modeling and measurements of IC packaging and related areas.
- A strong background in physics & chemistry with emphasis on both analytical and measurement methods.
- Working knowledge through experience in CFD and high-fidelity Multiphysics simulations.
- Must be proficient in using either Ansys Fluent and/ or Star CCM+.
- Experience in ACE+ Suite is an added advantage
- Detailed knowledge of material properties and material property test methods.
- A good understanding of semiconductor packaging processes and materials and technology and trends such as PECVD, Cryogenic cleaning, organic substrate properties, over molding materials and properties, wire-bonding materials and methods, C4 or Cu Pillar attachment methods, etc.
- Strong oral and written communication skills.
- Ability to work in a team environment and get along with other specialists to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
Degree required:
- MS or PhD from IIT/NIT/BITS/IISc with 4 to 8 years experience
- Mechanical Engineering, Applied Mechanics, Chemical Engineering, Physics, or related discipline
