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Intel Corporation

Power Integrity Engineer - Automotive

Early Applicant
  • 5 months ago
  • Be among the first 50 applicants

Job Description

Job Description

Team Introduction:

Intel Automotive is new Business Group within Corporate Strategy and Ventures responsible for automotive SOC and platform solution development. The Future of Automotive is trending towards open, consolidated, Software driven and connected network resulting in requirement of leading Silicon nodes to support software first architecture allowing future feature updates. Automotive brings significant opportunities in Package and Platform design with challenges on safety, security, quality, reliability, and power. Team is developing new Automotive infotainment and Centralized Compute Application SoC with strong project roadmap.

Roles And Responsibilities

In this position, the candidate will be responsible for providing Power Integrity solution within Intel Automotive Business unit. Candidate responsibilities include:

  • Deliver power integrity solutions for automotive segment package, platform
  • Develop and analyze power delivery networks including 2D and 3D model extraction and noise analysis across die/C4 bumps, package, socket and board.
  • Collaborate with silicon integration team, die floor planners and package design team to optimize the ondie decoupling partitions and implement the package decoupling scheme and voltage regulation for package/die
  • Perform comprehensive simulations (DC/AC/Transient) during development phase.
  • Provides guidance, solution space on implementation with the design team (SoC, Package, board)
  • Work with validation and debug teams during various project phases to analyze validation data or failures.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

  • Bachelor's / Master's Degree in Electrical Engineering with 5+ years of relevant industry experience.
  • Proven experiences on package and board level power integrity.
  • Experience with power integrity modeling and analysis tools, including HSPICE, PowerDC, PowerSI, or other similar design tools. Experience with Matlab, HFSS will be added advantage.
  • Innovative thinker, able to propose/drive solutions to tough product definition challenges to meet performance and functional requirements.
  • Ability to communicate effectively across multiple disciplines, such as silicon design, package design, board design, PCB layout, and mechanical design.
  • Great team player, willing to learn and flexible.

Preferred Qualifications

  • Signal integrity experience or knowledge will be added advantage.
  • Automotive domain experience will be added advantage.

Inside this Business Group

Corporate Strategy Office is chartered to support the executive office in driving corporate initiatives, including near and long-term strategy, major cross-group decision making and ensuring cross-company alignment. To deliver to that mission, the team owns shaping, driving and synthesizing insights to directionally orient trends as well as long range strategic planning/visioning , cross company alignment and greenfield innovation. Communications are essential to drive alignment so there is a focus on communications, community and acumen development. The team is ccommitted to ensuring that Intel efforts are aligned to, and actively driving success toward the most impactful business strategies.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel's offices for various positions and further requiring them to deposit money to be eligible for the interviews. We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at https://jobs.intel.com/ and not fall prey to unscrupulous elements.

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

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Date Posted: 19/06/2024

Job ID: 82247323

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